Gangwon Embedded Software Cooperative Research Center

Image Sensor Module

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Gangwon Embedded Software Cooperative Research Center
[Korea]

Address: #503, Joint Lab Building, Kangnungwonju National University, 120 Gangneung Daehangno Gangneung-si Gangwon-do

Product Details

Description

Compresses image data collected by a VGA CMOS image sensor by using a JPEG encoding chip and transmits the compressed image data through a wireless sensor network
Can adjust image size and quality upon request.
Hardware Features
- Image Sensor : 640 X 480 VGA, CMOS sensor
- On Chip Image Signal Processing
- Operating Voltage : 2.7V ~ 3.6V
- Operating Temperature : -30℃ ~ 70℃
Components
- Communication node + Image capture module

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